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Amphenol Commercial OSFP Interconnect System features 60 contacts per port, with a 0.6mm contact pitch, and eight high-speed channels. The OSFP footprint is optimized for signal integrity performance and is built for use in high-speed serial applications. This Amphenol Commercial interconnect system is enhanced for low crosstalk and offers ground commoning for resonance dampening. The module side features an integrated heat sink for optimal thermal performance. The OSFP series is designed for 1U applications, including cellular infrastructure, hubs, switches, servers, and more.
Features
Enables 112G PAM4 per channel transmission
800G aggregate bandwidth capacity
Compatible with all mating connector and cage configurations: single port, ganged, and stacked
System design enables up to 33W per port independent of cage configuration
Advanced internal ground features provide improved crosstalk performance over QSFP
Designed with considerations to support next-generation operating speeds: 224Gb/s PAM4
Part of Amphenol’s overall OSFP interconnect system
